Thermal and mechanical properties of copper powder filled poly(ethylene) composites

Tavman I.

POWDER TECHNOLOGY, vol.91, no.1, pp.63-67, 1997 (SCI-Expanded) identifier identifier

  • Publication Type: Article / Article
  • Volume: 91 Issue: 1
  • Publication Date: 1997
  • Doi Number: 10.1016/s0032-5910(96)03247-0
  • Journal Indexes: Science Citation Index Expanded (SCI-EXPANDED), Scopus
  • Page Numbers: pp.63-67
  • Keywords: poly(ethylene), filled polymers, composites, thermal conductivity, mechanical properties
  • Dokuz Eylül University Affiliated: No


The thermal conductivity and mechanical properties such as tensile strength, elongation at break, modulus of elasticity, and toughness of composites formed by copper powder filler embedded in a high density poly(ethylene) matrix are investigated experimentally and the results compared with existing theories. Thermal conductivity measurements are performed up to a filler concentration of 10 vol.%. A modified hot-wire technique is used to measure the thermal conductivity. The conductivity is best predicted by the Lewis and Nielsen model which takes into account the shape of the particles as well as the type of packing. The mechanical properties of high density poly(ethylene) filled with up to 18 vol.% Cu particles are investigated. The tensile strength, elongation at break and toughness decreased with increasing copper content, attributed to the introduction of discontinuities in the structure. The modulus of elasticity increased with increasing copper content.