Adhesion properties of CeO2 films produced from different precursors using sol-gel process


Celik E., ÖZGÜL M., Avci E., HASÇİÇEK Y. S.

MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS, vol.261, 2020 (SCI-Expanded) identifier identifier

  • Publication Type: Article / Article
  • Volume: 261
  • Publication Date: 2020
  • Doi Number: 10.1016/j.mseb.2020.114774
  • Journal Name: MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS
  • Journal Indexes: Science Citation Index Expanded (SCI-EXPANDED), Scopus, Academic Search Premier, Aerospace Database, Chimica, Communication Abstracts, Compendex, INSPEC, Metadex, Civil Engineering Abstracts
  • Keywords: CeO2 thin films, YBa2Cu3O7 (YBCO), Adhesion, Sol-gel, Tensile testing, Failure mode
  • Dokuz Eylül University Affiliated: No

Abstract

CeO2 films were deposited on Ni and Ag tapes by sol-gel process using nitrate, ammonium nitrate, colloidal, alkoxide, acetate, and oxalate based precursors and a detailed characterization of adhesion properties were performed in relation with structural features. The structural, microstructural and adhesion properties of the films heat-treated at 500 degrees C for 60 min in air were determined via XRD, ESEM and a mini tensile testing machine. The results showed that homogeneous films with cubic structure can be deposited on Ni and Ag tapes. The microstructure of the CeO2 films could also be tailored by altering precursor type, solvent, chelating agent and modifying liquid. The CeO2 joint samples with Ag tapes prepared from cerium(III)2,4 pentanedionate based solution exhibited the best adhesive properties because of polymeric sol and gel. The observed results in joint samples indicate a correlation between the failure types and the choice of solution from which CeO2 films prepared.