Research Information System
ICSHRS 4 th International Conference on Applied Sciences, Dubai, United Arab Emirates, 14 - 16 April 2023, pp.146-151
Performance is extremely important in electronic devices. Especially during use, any pause or
freezing may cause undesirable results. This is even more important for critical tools. Although
there are many parameters that affect performance in electronic devices, warming is one of the
most important parameters after the production process. In particular, the device temperature,
which affects the service life and performance, should be kept under control and should not
exceed the maximum level. This study is about fin structures added for cooling in electronic
devices. They are structures that aim to remove more heat by convection from a hot surface by
increasing the fin surface area. It is impossible to add a cooling system, especially for smallscale electronic structures. In this case, it is tried to improve the convection effects by providing
more surface area with fin structures. In the study carried out, the effect of the parallel
rectangular groove structure in the fins on the heat dissipation is evaluated with the 3D CFD
model using the student version of ANSYS engineering commercial software. First, the
efficiency of the rectangular fin is measured at 400 K fin bottom temperature and 300 K ambient
temperature. Then, the effect of the parallel rectangular grooves to be placed on the wing on
the heat removal from the wing and the efficiency of the wing is interpreted. For a heat
convection coefficient of 20 W/m2K, the efficiency is 78.11% for the non-corrugated fin in the
reference state. With 1 row of rectangular grooves positioned in parallel, the fin efficiency
increases by 5% and becomes 82.375%. It is seen that the wing efficiency increases with
rectangular grooves placed in 2,3 and 4 rows, but the increase tends to converge.