EMPLOYMENT OF QUALITY CONTROL FOR SOLDER PASTE THICKNESS OF INTEGRATED CIRCUIT USING FUZZY TRIANGULAR (Formula presented)− CHARTS

Basri N. A. Z. A., NASİBOĞLU E., Ariffin N. H. M., Amin N. A. M., Hamzah F. M., Sufahani S. F., ...Daha Fazla

Far East Journal of Mathematical Sciences, cilt.142, sa.4, ss.539-557, 2025 (Scopus) identifier identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 142 Sayı: 4
  • Basım Tarihi: 2025
  • Doi Numarası: 10.17654/0972087125030
  • Dergi Adı: Far East Journal of Mathematical Sciences
  • Derginin Tarandığı İndeksler: Scopus, zbMATH
  • Sayfa Sayıları: ss.539-557
  • Anahtar Kelimeler: (Formula Presented) charts, average run length (ARL), fuzzy (Formula Presented) charts, solder paste thickness, α-cuts
  • Dokuz Eylül Üniversitesi Adresli: Evet

Özet

Quality has become crucial for consumers, prompting the need for strict control measures. Statistical Process Control (SPC) is widely used to monitor and improve performance, traditionally assuming independent, normally distributed data. However, real-world data often contains uncertainties from human, measurement, or environmental factors, challenging traditional control chart use such as (Formula Presented) control charts. To overcome this, fuzzy control limits based on fuzzy set theory are introduced. This study uses α-cuts and fuzzy triangular numbers to develop fuzzy (Formula Presented) charts for monitoring solder paste thickness in integrated circuits. These fuzzy charts prove more effective than traditional ones, yielding lower average run length (ARL) values.