Tavman, I. H. And EVGİN, T. 2017. Thermally Conductive Polymer Nanocomposites for Thermal Management of Electronic Packaging. 23rd IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) , (Constanta, Romania), 64-67.

Tavman, I. H., & EVGİN, T., (2017). Thermally Conductive Polymer Nanocomposites for Thermal Management of Electronic Packaging . 23rd IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) (pp.64-67). Constanta, Romania

Tavman, Ismail, And TUBA EVGİN. "Thermally Conductive Polymer Nanocomposites for Thermal Management of Electronic Packaging," 23rd IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME), Constanta, Romania, 2017

Tavman, Ismail H. And EVGİN, TUBA. "Thermally Conductive Polymer Nanocomposites for Thermal Management of Electronic Packaging." 23rd IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) , Constanta, Romania, pp.64-67, 2017

Tavman, I. H. And EVGİN, T. (2017) . "Thermally Conductive Polymer Nanocomposites for Thermal Management of Electronic Packaging." 23rd IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) , Constanta, Romania, pp.64-67.

@conferencepaper{conferencepaper, author={Ismail Hakki Tavman And author={TUBA EVGİN}, title={Thermally Conductive Polymer Nanocomposites for Thermal Management of Electronic Packaging}, congress name={23rd IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME)}, city={Constanta}, country={Romania}, year={2017}, pages={64-67} }