Erbay, I. H. Et Al. 2023. Bioengineering Bone‐on‐a‐Chip Model Harnessing Osteoblastic and Osteoclastic Resolution. ADVANCED ENGINEERING MATERIALS , vol.2201063, no.2201063 , 1-10.

Erbay, I. H., Polatli, E., Koç, A. C., Özbilgiç, R., Karaman, O., & Güven, S., (2023). Bioengineering Bone‐on‐a‐Chip Model Harnessing Osteoblastic and Osteoclastic Resolution. ADVANCED ENGINEERING MATERIALS , vol.2201063, no.2201063, 1-10.

Erbay, Ibrahim Et Al. "Bioengineering Bone‐on‐a‐Chip Model Harnessing Osteoblastic and Osteoclastic Resolution," ADVANCED ENGINEERING MATERIALS , vol.2201063, no.2201063, 1-10, 2023

Erbay, Ibrahim H. Et Al. "Bioengineering Bone‐on‐a‐Chip Model Harnessing Osteoblastic and Osteoclastic Resolution." ADVANCED ENGINEERING MATERIALS , vol.2201063, no.2201063, pp.1-10, 2023

Erbay, I. H. Et Al. (2023) . "Bioengineering Bone‐on‐a‐Chip Model Harnessing Osteoblastic and Osteoclastic Resolution." ADVANCED ENGINEERING MATERIALS , vol.2201063, no.2201063, pp.1-10.

@article{article, author={Ibrahim Halilullah Erbay Et Al. }, title={Bioengineering Bone‐on‐a‐Chip Model Harnessing Osteoblastic and Osteoclastic Resolution}, journal={ADVANCED ENGINEERING MATERIALS}, year=2023, pages={1-10} }